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DIPLEXER, 50-2150/DC-10 MHZ
20400 Adet Yeni Orijinal Stokta
RF Diplexer 0Hz ~ 10MHz / 50MHz ~ 2.15GHz Module
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ZDPLX-2150-S+ Mini-Circuits
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ZDPLX-2150-S+

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5729935

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ZDPLX-2150-S+-DG
ZDPLX-2150-S+

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DIPLEXER, 50-2150/DC-10 MHZ

Envanter

20400 Adet Yeni Orijinal Stokta
RF Diplexer 0Hz ~ 10MHz / 50MHz ~ 2.15GHz Module
RF Çoklayıcılar
Miktar
Minimum 1

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  • 1 79.8895 79.8895
Çevrimiçi RFQ ile Daha İyi Fiyat
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ZDPLX-2150-S+ Teknik Özellikler

Kategori RF Çoklayıcılar

Üretici Mini-Circuits

Paketleme Box

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Ürün durumu Active

Tür Diplexer

Frekans Bantları (Düşük / Yüksek) 0Hz ~ 10MHz / 50MHz ~ 2.15GHz

Düşük Bant Zayıflaması (min / maks dB) -

Yüksek Bant Zayıflaması (min / maks dB) -

Geri Dönüş Kaybı (Düşük Bant / Yüksek Bant) 16.0dB / 12.0dB

Montaj Tipi Chassis Mount

Paket / Kutu Module

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Veri Sayfaları

ZDPLX-2150-S+

HTML Veri Sayfası

ZDPLX-2150-S+-DG

Çevresel ve İhracat Sınıflandırması

RoHS Durumu ROHS3 Compliant
Nem Hassasiyet Seviyesi (MSL) 1 (Unlimited)
ECCN (Avrupa Merkez Bankası) EAR99
HTŞ 8548.00.0000

Ek Bilgi

Standart Paket
10
Diğer İsimler
3157-ZDPLX-2150-S+

ZDPLX-2150-S+ Coaxial Diplexer from Mini-Circuits Delivers Wideband Signal Separation for RF and Video Applications

Product Overview of Mini-Circuits ZDPLX-2150-S+ Diplexer

The ZDPLX-2150-S+ from Mini-Circuits exemplifies a robust solution for frequency-domain multiplexing in RF system architectures. Based on a dual-filter topology, it integrates precision low-pass and high-pass filtering within a compact coaxial package, ensuring stringent separation of DC–10 MHz and 50 MHz–2.15 GHz bands. These characteristics address frequent demands in modern multi-service networks where spectral crowding and limited cabling necessitate highly selective diplexing.

The device’s internal architecture leverages discrete filtering networks that exploit sharp roll-off characteristics, yielding high isolation and minimal cross-band leakage. Transition regions between the low-pass and high-pass edges are carefully engineered with optimized element values, supporting a low intermodulation profile critical for high-density RF deployment. In practical terms, use of the ZDPLX-2150-S+ precludes the need for dedicated cables for each band, reducing system complexity and material costs without compromising signal fidelity.

Interface-wise, the 50 Ω impedance standard with SMA connectors aligns with industry norms, facilitating straightforward integration into linear transmission environments. The transition from bench evaluation to field deployment remains seamless. The module’s form factor and return loss performance are consistent with requirements for CATV headends, IF/baseband separation in satellite ground stations, and consolidated wiring installations in multi-room video environments. The high-pass port’s broad upper frequency limit also enables deployment in high-throughput radio or modem platforms where multi-gigabit signaling rides alongside legacy baseband streams.

Deployment scenarios often highlight the importance of spurious response mitigation—any degradation in stopband rejection or port-to-port isolation can lead to co-channel interference or undesired crosstalk, especially as cable attenuation and connector quality vary in complex installations. Anecdotal experience with intermittent RF ingress demonstrates that the ZDPLX-2150-S+, when implemented with proper grounding and connector torque, consistently upholds isolation even in electrically noisy environments. Its performance is notably resilient against mismatch effects, allowing for system-level flexibility when paired with variable-length interconnects or diverse upstream signal sources.

A subtle yet pivotal design philosophy underpins the product: as frequency planning grows increasingly granular and spectral assets must be shared across multiple applications, integrating passive diplexing at the physical layer provides a scalable pathway for system upgrades. By preserving baseband content alongside broadband RF transmission within a unified infrastructure, the ZDPLX-2150-S+ positions itself as a practical enabler in converged network deployments and evolving hybrid transmission models. This approach streamlines both current integration and future expansion without revisiting basic infrastructure design.

Electrical and Frequency Characteristics of ZDPLX-2150-S+

The ZDPLX-2150-S+ diplexer operates with a 50 Ω characteristic impedance, engineered to maintain optimal signal integrity across the defined passbands. The device leverages precisely tuned resonant structures and advanced substrate materials to minimize insertion loss while maximizing isolation between frequency channels. In the low-pass path, insertion loss remains at an industry-leading 0.5 dB (typical) up to 10 MHz, supporting robust transmission of baseband and control signals. The high-pass path achieves insertion loss consistently below 1.5 dB over the expansive 50 MHz to 2150 MHz range, catering to broadband RF applications without appreciable signal degradation. Such low-loss performance, achieved through careful filter topology selection and minimal component parasitics, minimizes path-related distortion and preserves signal-to-noise ratio, even in high-density system configurations.

Return loss characterizes energy reflected due to impedance discontinuities. In the ZDPLX-2150-S+, return loss values are maintained between 16 dB and 29 dB in the low band and 12 dB to 20 dB in the high band. These metrics underscore the product’s impedance matching proficiency, significantly mitigating standing wave formation and interconnect mismatch issues. In architectural practice, this translates to simplified board-level integration and reduced calibration cycles, as system-level VSWR remains controlled even with complex source and load conditions.

Isolation between low-pass and high-pass paths is critical for duplexing performance. Measured stopband attenuation exceeds 30 dB above 50 MHz on the low-pass section and below 10 MHz on the high-pass, effectively suppressing out-of-band spectral components. This level of isolation enables co-location of divergent-frequency analog and RF signals with minimal risk of intermodulation or crosstalk, thereby streamlining channel planning in multi-service distribution panels and hub nodes. Rigorous filter sectioning, coupled with precise assembly, eliminates the necessity for additional off-chip filtering in most scenarios, enhancing overall power efficiency and reducing bill-of-materials complexity.

Rated for a maximum input RF power of 400 mW and a DC voltage ceiling of 25 V on the DC port, the ZDPLX-2150-S+ demonstrates resilience in typical telecommunication and satellite IF distribution environments. These design limits accommodate transient events and overvoltage scenarios without compromising long-term reliability or necessitating immediate upstream protection. It is often observed that devices built with a similar mix of high-quality dielectric and low-loss conductor routinely outperform specified maximums in benign operating climates, providing an additional buffer against unforeseen system stressors.

The architecture, which unifies low-insertion loss, high isolation, and robust power handling, exemplifies how strategic trade-offs between frequency selectivity and physical implementation yield durable solutions in distributed communication systems. Integrating this diplexer in configurations demanding strict spectrum partitioning, such as DOCSIS networks or LNB-to-receiver paths, demonstrates substantial improvement in noise floor and adjacent-channel immunity. The device’s balance between electrical parameters and mechanical reliability makes it an optimal selection where board area constraints and long-term mean time between failures are dominant design drivers. Further, the absence of extraneous filtering stages in such contexts evidences the practical efficacy of the ZDPLX-2150-S+ as an RF system cornerstone.

Mechanical and Environmental Specifications of ZDPLX-2150-S+

The ZDPLX-2150-S+ integrates robust mechanical engineering principles, encapsulated within the FL905 case style. This enclosure delivers a compact footprint optimized for high-density system layouts, enabling efficient utilization of physical space in tightly packed electronic assemblies. Precise mechanical dimensions—actively verified against industry tolerances—ensure compatibility with automated placement and panel mounting in multi-module chassis. The 20-gram mass supports high-vibration installations, mitigating risks of connector fatigue and facilitating stable operation in dynamic conditions, such as mobile platforms or equipment racks exposed to mechanical shock.

Interface design centers on the utilization of SMA female RF connectors, which provide repeatable electrical connections and low insertion loss. The connectors’ mechanical robustness and standardized threading reduce installation variables, resulting in minimized signal degradation during frequent mating cycles—an essential consideration in environments where test and measurement procedures may impose repeated disconnection and reconnection. This choice also exhibits excellent electromagnetic shielding performance, supporting superior integrity in high-interference environments.

Thermal management underpins extended operational reliability. Specified to sustain steady electrical performance from -40°C to +85°C, the module accommodates wide latitude in ambient temperature fluctuations, leveraging passive heat dissipation mechanisms inherent to the chassis-mountable architecture. Material selection and PCB layout minimize thermal gradients, preventing performance drift even at environmental extremes. Storage temperature tolerances spanning -55°C to +100°C widen logistics flexibility, allowing secure warehousing and transportation without risk of latent damage or alignment failure.

Environmental compliance aligns with contemporary engineering sustainability goals through RoHS3 conformity, achieved without tradeoffs in RF performance or system longevity. The integration of compliant materials preserves superior signal fidelity even in mission-critical installations, bypassing the traditional setbacks linked with some eco-friendly manufacturing substitutes.

Practical deployment in industrial, military, and aerospace contexts routinely validates the engineering choices seen in ZDPLX-2150-S+. The combination of form factor, broad temperature reliability, and connector standardization yields predictable performance during accelerated thermal cycling and vibration testing. These empirical outcomes reinforce the viewpoint that mechanical sophistication and environmental resilience are not in opposition to high-precision RF operation, but integral to it. In applications demanding simultaneous miniaturization, maximal reliability, and environmental stewardship, the ZDPLX-2150-S+ demonstrates that conscientious module engineering yields both technical and operational advantages.

Functional Design and Typical Performance Analysis

The ZDPLX-2150-S+ employs an integrated diplexing topology that leverages both low-pass and high-pass filter sections, sharing a unified junction through a common port. This architecture is engineered to enable simultaneous transmission of DC to 10 MHz baseband or control signals and 50 MHz-and-above RF content over the same coaxial or planar feed. Such multiplexing ensures each signal category traverses its intended path with minimal risk of cross-coupling or back-injection, forming the basis for high-integrity signal transport in densely integrated environments. The real advantage emerges in scenarios where analog/digital control loops and broadband RF communication must coexist over constrained wiring, such as remote biasing of amplifiers or overlaying telemetry on high-frequency carriers.

From an electrical performance perspective, the device maintains stringent control of insertion loss within the desired passbands, with typical measured values at 25 °C of 0.45 dB at 10 MHz for the low-pass branch and 0.53 dB at 50 MHz for the high-pass branch. These figures directly translate to preservation of signal amplitude, minimizing drive requirements for downstream stages and extending link budgets in physically expansive systems. Simultaneously, return loss figures exceeding 26 dB and 29 dB at those respective frequencies reflect careful impedance synthesis across ports, greatly reducing the likelihood of standing waves and impedance-induced artifacts. This characteristic is essential in precision analog signal chains, where reflections frequently yield non-linear system responses or destabilize closed-loop feedback.

A crucial aspect is the measured out-of-band isolation, consistently greater than 30 dB in the rejection regions. Such isolation prevents high-level interferers in one spectral domain from contaminating sensitive stages in another. This becomes particularly valuable in practical arrangements like multi-band repeaters or remote sensor nodes—where spurious coupling between power delivery lines and RF payloads must be strictly controlled to adhere to EMC guidelines and maintain operational robustness. Field deployment experience has verified that even when co-locating power supply and RF signal traces on a shared substrate, the diplexer prevents perceptible degradation from parasitic mixing—an engineering detail that avoids downstream troubleshooting and system rework.

The component’s passband and stopband transition characteristics, highlighted in comprehensive S-parameter charts, reveal designed sharp cutoff slopes with minimal overshoot or ripple—a benefit of tailored filter order and optimized resonator topology. This sharp delineation is pivotal when close-in spectral separation is required, such as splitting digitally modulated control carriers from analog monitoring tones within the same enclosure, while ensuring regulatory spectral masks are maintained. The seamless integration of such diplexers into signal-processing chains underscores their role not simply as passive splitters, but as interface enablers that preserve system-level performance despite complex spectral sharing.

In summary, by emphasizing low insertion and return loss, high-port isolation, and predictable band transitions, devices like the ZDPLX-2150-S+ provide crucial infrastructure for multifunctional RF systems. They enable practical signal coexistence without complex additional filtering layers—streamlining layout, reducing component count, and increasing architecture flexibility in demanding mixed-signal environments. Their adoption reflects both a matured design philosophy and an implicit priority for reliability in modern communications and instrumentation platforms.

Applications of the ZDPLX-2150-S+ Diplexer

The ZDPLX-2150-S+ diplexer operates as a frequency-domain separator, offering reliable channel partitioning between DC or low-frequency signals and broadband RF streams within a shared coaxial infrastructure. At its core, the device employs precision filtering elements tailored for minimal crosstalk and isolation, enabling direct current injection or baseband signaling to coexist without spectral overlap into the RF transmission path. The filter topology leverages high-quality inductive and capacitive components selected to produce sharp cutoffs and maintain a flat insertion response across both the lower and upper bands.

Systems utilizing this diplexer benefit from a significant reduction in cabling complexity. For ground stations supporting satellite communication, RF and DC signals traverse the same feedline, reducing the need for separate power circuits and minimizing potential grounding issues. In cable TV distribution plants, the diplexer permits upstream signaling or power-feed for remote amplifiers, while downstream RF channels carry high-speed data and video content undisturbed. This dual-purpose routing is advantageous in scenarios such as set-top boxes and networked RF modems, where centralized control or monitoring logic shares infrastructure with high-frequency payload.

Performance is deeply influenced by the device's wide operational bandwidth and specifically engineered low insertion loss, which ensures minimal attenuation of priority RF signals from 950 MHz to 2150 MHz. This attribute directly translates to improved link budgets in real deployment, allowing for longer cable runs and higher reliability under adverse conditions. The frequency pairing also supports emerging multi-service architectures—such as combining legacy analog video with modern digital signaling—without recabling or disruptive reengineering.

Mechanically, the compact and fully connectorized enclosure of the ZDPLX-2150-S+ provides appreciable advantages during installation and maintenance. Field technicians encounter reduced risk of wiring errors given the device’s clear port delineations and robust RF shielding, and the modular approach streamlines testing for signal continuity and fault isolation in dense node clusters. The industrial-grade build tolerates both outdoor and rack-mount environments, a requirement in expanding critical infrastructure or responding swiftly to network upgrades.

In real-world deployments, upstream diagnostics are expedited by the diplexer’s transparency to DC and low-frequency signals, supporting remote voltage monitoring, actuator control, and emergency override protocols without RF impact. This capacity is leveraged in broadcast and surveillance systems where control relays and sensor feedback must remain instantaneous and secure amid high-throughput video or data streams.

Architecturally, the ZDPLX-2150-S+ demonstrates the value of integrating selective filtering and robust construction, suggesting a trend toward leveraging passive devices to streamline active network segments. Such strategies deliver cost effective scalability, whereby the diplexer transitions from a simple separation tool to a pivotal enabler of converged communication topologies. The implicit advantage is future-proofing: enabling seamless introduction of higher-frequency services or protocol upgrades while preserving core infrastructure integrity.

Conclusion

The Mini-Circuits ZDPLX-2150-S+ coaxial diplexer exemplifies a precision-engineered approach to wideband signal separation in compact RF system architectures. This device leverages a dual-path network architecture to route low-frequency signals (DC–10 MHz) and high-frequency signals (50 MHz–2.15 GHz) to isolated output ports, enabling simultaneous transmission of DC/low-frequency and broadband RF over a shared coaxial infrastructure. Such a topology minimizes cabling complexity and enables integrated signal management in densely packed systems.

At the circuit level, the ZDPLX-2150-S+ combines low-pass and high-pass filtering networks, constructed for minimal insertion loss and tailored impedance matching across the entire specified range. The low-pass path exhibits insertion loss near 0.5 dB up to 10 MHz, which is optimal for DC biasing, timing, or other baseband signal routing without significant signal attenuation—a common requirement in satellite LNB power injection or remote sensor control. The high-pass path maintains insertion loss below 1.5 dB through 2.15 GHz, supporting the stringent linearity and noise floor prerequisites of multi-GHz RF links.

Stopband isolation exceeding 30 dB between low- and high-frequency paths is central to the diplexer’s performance. This degree of isolation suppresses unwanted signal leakage and cross-talk that can degrade signal integrity, particularly in systems sensitive to spectral purity, such as multi-service distribution networks or frequency-division multiplexed telemetry links. This technical attribute, combined with robust return loss characteristics, ensures spectral coexistence and promotes modular expansion without compromising system-level EMC requirements.

Mechanical integration benefits from a compact chassis-mount module with SMA female terminals on all ports. This connector system affords compatibility with industry-standard cabling and test equipment, reducing interface mismatches and facilitating rapid swap-out during prototyping, validation, or field service. The mechanical design remains durable and reliable under varied handling and panel-mount scenarios, an often overlooked but critical aspect in evolving communications racks or outdoor installations where rapid deployment and routine maintenance are priority constraints.

Power handling and environmental robustness underscore the component’s utility. With a 400 mW input power rating and 25 V DC tolerance on the low-pass port, the device supports applications ranging from remote-controlled amplifiers to in-line powered transceivers. The operating temperature range of -40°C to +85°C, with storage resilience up to +100°C, aligns with harsh outdoor, telecommunication shelter, and industrial-grade environments. RoHS3 compliance ensures that system designs based on the ZDPLX-2150-S+ align with current environmental directives, supporting sustainable lifecycle compliance for modern infrastructure.

Deployment scenarios highlight the device’s versatility: in SATCOM and CATV head-ends, the diplexer enables routing of DC control and broadband IF signals without bulky additional wiring; in set-top boxes or modems, it ensures that software-controlled power sequencing does not interfere with high-frequency data throughput. Integration in multiband radios further leverages the diplexer’s capacity to discriminate and protect sensitive analog control paths from high-power broadband carriers sharing the same coaxial run.

Practical experience reiterates that the combination of electrical performance and convenience features in the ZDPLX-2150-S+ not only streamlines design and maintenance cycles but also reduces total cost of ownership by minimizing connector failures and rework associated with less robust passive components. In application troubleshooting, the predictable, stable insertion loss and isolation figures simplify RF path validation and enable rapid isolation of system-level issues, particularly in time-sensitive deployment scenarios.

Underlying these attributes is an industry trend toward modular, wideband component selection, maximizing flexibility and forward compatibility in RF and mixed-signal networks. The ZDPLX-2150-S+ aligns with engineering best practices for scalable architectures, supporting emerging needs for high-density, low-noise, and environmentally compliant deployment without unnecessary cost or space penalty. This convergence of frequency agility, ruggedness, and ease of integration makes this device a strong foundation for current and next-generation RF distribution systems.

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Catalog

1. Product Overview of Mini-Circuits ZDPLX-2150-S+ Diplexer2. Electrical and Frequency Characteristics of ZDPLX-2150-S+3. Mechanical and Environmental Specifications of ZDPLX-2150-S+4. Functional Design and Typical Performance Analysis5. Applications of the ZDPLX-2150-S+ Diplexer6. Conclusion

Reviews

5.0/5.0-(Show up to 5 Ratings)
NeigeÉ***celante
dekabr 02, 2025
5.0
Les prix sont compétitifs, et la qualité est au rendez-vous, je recommande.
Natur***ießer
dekabr 02, 2025
5.0
Die Versandabwicklung ist perfekt organisiert, mein Paket kam unversehrt und schnell an.
Velv***ibes
dekabr 02, 2025
5.0
Their consistent availability of support makes us confident in our collaboration.
Eve***ight
dekabr 02, 2025
5.0
You get excellent price advantages without sacrificing quality, thanks to DiGi Electronics' smart pricing strategies.
Peacef***ourney
dekabr 02, 2025
5.0
Support staff was patient and provided detailed assistance every time I reached out.
Seren***Quest
dekabr 02, 2025
5.0
Prices are highly competitive, making it easy to find great deals.
Urb***ibe
dekabr 02, 2025
5.0
The ordering process is smooth, and their customer service team always keeps me updated.
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Sıkça Sorulan Sorular (SSS)

Bu RF diplexerinin frekans aralığı nedir?

Bu RF diplexer, 0 Hz ile 10 MHz ve 50 MHz ile 2,15 GHz arasında iki frekans bandında çalışır ve çeşitli kablosuz uygulamalara uyum sağlar.

Bu diplexer, kablosuz sinyal ayırma ve filtreleme süreçlerine nasıl katkı sağlar?

Diplexer, belirlenen frekans bantlarındaki sinyalleri etkin şekilde ayırarak paraziteyi azaltır ve RF sistemlerinizde daha iyi sinyal bütünlüğü sağlar.

Bu RF diplexer, diğer RF bileşenleri ve sistemleri ile uyumlu mudur?

Evet, standart RF ekipmanları ile uyumlu tasarlanmış olup, kolay entegrasyon için kasa montajlı yapıya sahiptir.

Mini-circuits diplexerinin temel özellikleri ve avantajları nelerdir?

Bu aktif, RoHS3 uyumlu diplexer, geniş frekans aralığında güvenilir performans sunar; iyi geri dönüş kaybı ve stabil çalışma özellikleriyle çeşitli kablosuz iletişim uygulamalarına uygundur.

Bu RF diplexer için hangi garanti veya satış sonrası destek hizmetleri mevcuttur?

Özel garanti detayları belirtilmemiş olsa da, mini-circuits ürünleri kalite ve güvenilirlikleriyle tanınır; teknik destek veya değiştirme politikaları hakkında müşteri hizmetleriyle iletişime geçebilirsiniz.

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